Listed as a BSX 2026 exhibitor
other
Reported date/window: 2026-09-07/2026-09-09

Smiths Interconnect, a Molex company, is the cornerstone of our Aerospace, Defence and Space portfolio, delivering high-reliability connectivity, RF/microwave, fibre-optic and semiconductor test solutions for mission-critical applications. Its portfolio includes hyperboloid-contact connectors, Micro-D/Nano-D, ARINC, D-Sub, rack & panel, high-speed Twinax/Quadrax, fibre-optic interconnects, RF components up to 110 GHz, rugged optical transceivers, and space-qualified connectivity solutions. Molex group offering complements this offering with flight-proven Micro-D and Nano-D connectors, high-density verSI™️ connectors, hybrid power/signal/RF solutions, and space-qualified cable assemblies optimised for SWaP-constrained platforms. D-Sub and industrial interconnect solutions, while Molex broadens the portfolio with embedded electronics, VPX platforms, advanced packaging, cable assemblies and custom engineered solutions. Together, we provide end-to-end solutions for satellites, launch vehicles, avionics, radar, electronic warfare, ISR, communications, test systems and ground support equipment, backed by global engineering, qualification testing, customization and manufacturing capabilities.
Smiths Interconnect, a Molex company, is the cornerstone of our Aerospace, Defence and Space portfolio, delivering high-reliability connectivity, RF/microwave, fibre-optic and semiconductor test solutions for mission-critical applications. Its portfolio includes hyperboloid-contact connectors, Micro-D/Nano-D, ARINC, D-Sub, rack & panel, high-speed Twinax/Quadrax, fibre-optic interconnects, RF components up to 110 GHz, rugged optical transceivers, and space-qualified connectivity solutions. Molex group offering complements this offering with flight-proven Micro-D and Nano-D connectors, high-density verSI™️ connectors, hybrid power/signal/RF solutions, and space-qualified cable assemblies optimised for SWaP-constrained platforms. D-Sub and industrial interconnect solutions, while Molex broadens the portfolio with embedded electronics, VPX platforms, advanced packaging, cable assemblies and custom engineered solutions. Together, we provide end-to-end solutions for satellites, launch vehicles, avionics, radar, electronic warfare, ISR, communications, test systems and ground support equipment, backed by global engineering, qualification testing, customization and manufacturing capabilities.
Location note: Indian entity location; distinct from the parent company's global headquarters.
other
Reported date/window: 2026-09-07/2026-09-09