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Smiths Interconnect India Private Limited

ISFC-2026-00196activeprivate

Smiths Interconnect, a Molex company, is the cornerstone of our Aerospace, Defence and Space portfolio, delivering high-reliability connectivity, RF/microwave, fibre-optic and semiconductor test solutions for mission-critical applications. Its portfolio includes hyperboloid-contact connectors, Micro-D/Nano-D, ARINC, D-Sub, rack & panel, high-speed Twinax/Quadrax, fibre-optic interconnects, RF components up to 110 GHz, rugged optical transceivers, and space-qualified connectivity solutions. Molex group offering complements this offering with flight-proven Micro-D and Nano-D connectors, high-density verSI™️ connectors, hybrid power/signal/RF solutions, and space-qualified cable assemblies optimised for SWaP-constrained platforms. D-Sub and industrial interconnect solutions, while Molex broadens the portfolio with embedded electronics, VPX platforms, advanced packaging, cable assemblies and custom engineered solutions. Together, we provide end-to-end solutions for satellites, launch vehicles, avionics, radar, electronic warfare, ISR, communications, test systems and ground support equipment, backed by global engineering, qualification testing, customization and manufacturing capabilities.

About

Smiths Interconnect, a Molex company, is the cornerstone of our Aerospace, Defence and Space portfolio, delivering high-reliability connectivity, RF/microwave, fibre-optic and semiconductor test solutions for mission-critical applications. Its portfolio includes hyperboloid-contact connectors, Micro-D/Nano-D, ARINC, D-Sub, rack & panel, high-speed Twinax/Quadrax, fibre-optic interconnects, RF components up to 110 GHz, rugged optical transceivers, and space-qualified connectivity solutions. Molex group offering complements this offering with flight-proven Micro-D and Nano-D connectors, high-density verSI™️ connectors, hybrid power/signal/RF solutions, and space-qualified cable assemblies optimised for SWaP-constrained platforms. D-Sub and industrial interconnect solutions, while Molex broadens the portfolio with embedded electronics, VPX platforms, advanced packaging, cable assemblies and custom engineered solutions. Together, we provide end-to-end solutions for satellites, launch vehicles, avionics, radar, electronic warfare, ISR, communications, test systems and ground support equipment, backed by global engineering, qualification testing, customization and manufacturing capabilities.

Location note: Indian entity location; distinct from the parent company's global headquarters.

Timeline

Listed as a BSX 2026 exhibitor

other

Reported date/window: 2026-09-07/2026-09-09

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