Listed as a BSX 2026 exhibitor
other
Reported date/window: 2026-09-07/2026-09-09
Kohesi Bond
ISFC-2026-00131activeprivate
At Kohesi Bond, we engineer and manufacture over 300 custom polymer formulations—available as one and two-component systems utilizing advanced epoxy, polyimide, and sodium silicate chemistries tailored for critical space and aerospace applications. Core Technical Capabilities: • Space Vacuum & Cryogenic Systems: NASA low-outgassing (ASTM E-595) epoxies designed for ultra-high vacuum stability and continuous serviceability at cryogenic temperatures. • Thermal Management: High thermal conductivity compounds for heat dissipation in satellite electronics, payloads, and power systems. • Electrical Conductivity & Insulation: Options ranging from highly electrically conductive die-attach systems to high dielectric strength insulative potting compounds. • Optical Systems: Optically clear, non-yellowing formulations with high spectral transmittance for sensor lenses and laser optics. Application Modes: Custom engineered for precision bonding, sealing, coating, potting, encapsulation, and fiber impregnation, supported by custom viscosities, cure schedules, and specialized cartridge/syringe packaging.
About
At Kohesi Bond, we engineer and manufacture over 300 custom polymer formulations—available as one and two-component systems utilizing advanced epoxy, polyimide, and sodium silicate chemistries tailored for critical space and aerospace applications. Core Technical Capabilities: • Space Vacuum & Cryogenic Systems: NASA low-outgassing (ASTM E-595) epoxies designed for ultra-high vacuum stability and continuous serviceability at cryogenic temperatures. • Thermal Management: High thermal conductivity compounds for heat dissipation in satellite electronics, payloads, and power systems. • Electrical Conductivity & Insulation: Options ranging from highly electrically conductive die-attach systems to high dielectric strength insulative potting compounds. • Optical Systems: Optically clear, non-yellowing formulations with high spectral transmittance for sensor lenses and laser optics. Application Modes: Custom engineered for precision bonding, sealing, coating, potting, encapsulation, and fiber impregnation, supported by custom viscosities, cure schedules, and specialized cartridge/syringe packaging.