
Kohesi Bond
Mumbai, Maharashtra, India
- Founded
- —
- Headquarters
- Mumbai
- Ownership
- private
- Employees
- —
- Vehicles
- 0
- People
- 0
About
At Kohesi Bond, we engineer and manufacture over 300 custom polymer formulations—available as one and two-component systems utilizing advanced epoxy, polyimide, and sodium silicate chemistries tailored for critical space and aerospace applications. Core Technical Capabilities: • Space Vacuum & Cryogenic Systems: NASA low-outgassing (ASTM E-595) epoxies designed for ultra-high vacuum stability and continuous serviceability at cryogenic temperatures. • Thermal Management: High thermal conductivity compounds for heat dissipation in satellite electronics, payloads, and power systems. • Electrical Conductivity & Insulation: Options ranging from highly electrically conductive die-attach systems to high dielectric strength insulative potting compounds. • Optical Systems: Optically clear, non-yellowing formulations with high spectral transmittance for sensor lenses and laser optics. Application Modes: Custom engineered for precision bonding, sealing, coating, potting, encapsulation, and fiber impregnation, supported by custom viscosities, cure schedules, and specialized cartridge/syringe packaging.
At Kohesi Bond, we engineer and manufacture over 300 custom polymer formulations—available as one and two-component systems utilizing advanced epoxy, polyimide, and sodium silicate chemistries tailored for critical space and aerospace applications. Core Technical Capabilities: • Space Vacuum & Cryogenic Systems: NASA low-outgassing (ASTM E-595) epoxies designed for ultra-high vacuum stability and continuous serviceability at cryogenic temperatures. • Thermal Management: High thermal conductivity compounds for heat dissipation in satellite electronics, payloads, and power systems. • Electrical Conductivity & Insulation: Options ranging from highly electrically conductive die-attach systems to high dielectric strength insulative potting compounds. • Optical Systems: Optically clear, non-yellowing formulations with high spectral transmittance for sensor lenses and laser optics. Application Modes: Custom engineered for precision bonding, sealing, coating, potting, encapsulation, and fiber impregnation, supported by custom viscosities, cure schedules, and specialized cartridge/syringe packaging.
Timeline
1 milestone- Verified
